Original Pin Residues Issue Inner and outer diameter of dirt adhering whitereaction product, and the thickness should begreater than 0.01 ~ 0.07 mm Plasma ETCH process, the product is likely toresult in a white chamber repeated contaminationand residues will accumulate inside the thicknessof K pin in vacuum environment. Recommend “regular maintenance to replace it”,reduce duplication and improve the likelihood ofcontamination yield |
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